Hardware Redesign for Mechanically Stressed Industrial Electronics
Targeted hardware modifications on three heating controllers to fix mechanical-stress and component issues without a full redesign.
- Analyzed and modified circuit sections on three controller variants
- Addressed mechanical stress points and obsolete/unavailable components
- Kept changes compatible with existing mechanics, enclosures, and production
- Technologies: Eagle CAD, LTspice, PCB design
Context
Several heating controllers showed mechanical stress issues and component-related problems that required modifications to existing hardware.
My Role
I performed hardware modifications on three different heating controllers. This included analysis, adaptation of circuit sections and preparation of the changes for validation and further product maintenance.
Technical Challenge
The objective was not a complete redesign, but targeted improvement of existing devices. The changes had to remain compatible with existing mechanics, enclosures, production processes and product requirements.
Solution
The affected hardware areas were analyzed and adapted. Obsolete or unavailable components were also considered so that the devices could remain manufacturable and maintainable.
Impact
The project reduced risks caused by mechanical stress and component obsolescence and supported the continued use of existing product series.
Technologies
Eagle CAD, LTspice, PCB, Industrial electronics, Obsolescence management
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